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Lokwon Kim

Deepx联合创始人兼首席执行官,韩国
DEEPX

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Kim Lokwon is driven to advance low-power, high-performance AI chips for edge devices. With deep expertise in system semiconductors, he has held key roles at Broadcom, IBM, Cisco Systems and Apple Inc., where he contributed to application processor design and large-scale production, including AI processors. He holds a PhD from the University of California Los Angeles and has authored over 100 patents and 14 journal papers in the Institute of Electrical and Electronics Engineers and Association for Computing Machinery publications.